– A Perspective on Device, Circuit, and System
Presentation by Georgia Tech & Global Foundries
May 9, 2019
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Presenters
Hua Wang is an associate professor at the School of Electrical and Computer Engineering (ECE) at Georgia Institute of Technology and the director of Georgia Tech Electronics and Micro-System (GEMS) lab. He received his M.S. and Ph.D. degrees in electrical engineering from the California Institute of Technology, Pasadena, in 2007 and 2009, respectively. Dr. Wang’s areas of research include innovative mixed-signal, RF, and mm-Wave integrated circuits and hybrid systems for wireless communication, radar, imaging, and bioelectronics applications. He received the DARPA Young Faculty Award in 2018, the National Science Foundation CAREER Award in 2015, the IEEE MTT-S Outstanding Young Engineer Award in 2017, the Georgia Tech Sigma Xi Young Faculty Award in 2016, the Georgia Tech ECE Outstanding Junior Faculty Member Award in 2015, and the Lockheed Dean’s Excellence in Teaching Award in 2015. He held the Demetrius T. Paris Professorship from 2014 to 2018. Dr. Wang is an Associate Editor of the IEEE Microwave and Wireless Components Letters (MWCL) and a Guest Editor of the IEEE Journal of Solid-State Circuits (JSSC). He is a Technical Program Committee (TPC) Member for IEEE ISSCC, RFIC, CICC, and BCICTS conferences. He is a Steering Committee Member for IEEE RFIC and CICC. He is a Distinguished Lecturer (DL) for the IEEE Solid-State Circuits Society (SSCS) for the term of 2018-2019. He serves as the Chair of the Atlanta’s IEEE CAS/SSCS joint chapter that won the IEEE SSCS Title: Solutions for 5G mmWave from Silicon to Antenna Integrated Modules.
Ned Cahoon received the A.B. degree in physics from Harvard University in 1980. He joined IBM in 1980 in Poughkeepsie, NY, where he worked in engineering and management positions responsible for DRAM reliability and assurance in IBM’s Data System Division. In 1988, he moved to IBM’s Microelectronics Division where he contributed to the research and development of AlGaAs and InP laser technology. Beginning in 1991, he managed engineering teams in IBM’s MLC packaging lab and manufacturing plant. In 1995, he was part of a new business initiative within IBM with the mission to develop and commercialize SiGe technology, and he has been involved in the RF Business Unit of IBM and now GLOBALFOUNDRIES ever since. He is currently a Director at GLOBALFOUNDRIES, responsible for business development of SiGe and RFSOI technologies.
Anirban Bandyopadhyay is the Director, Business Development within GLOBALFOUNDRIES, USA and is located at Hopewell Junction, New York. His work is currently focused on hardware architecture & technology evaluations and business development for different RF and mmWave applications. Prior to joining GLOBALFOUNDRIES, he was with IBM Microelectronics for 8 years where he used to manage design enablement group for wireless applications and also led RF strategic applications and marketing. During 2000-2007, Dr. Bandyopadhyay was with Intel, California where he worked on different areas like Silicon Photonics, signal integrity in RF & Mixed signal SOC’s. He did his PhD in Electrical Engineering from Tata Institute of Fundamental Research, India and Post-Doctoral research at Nortel, Canada and at Oregon State University, USA. He represents Global Foundries in different industry consortia on RF/mmWave applications and is a Distinguished Lecturer of IEEE Electron Devices Society.